Sharp has created technology that can cut the cost of producing a silicon wafer by half. Nikkei reports that the technology uses a substrate that is put into contact with molten silicon. The film of silicon created by the contact is peeled off, and the edges are removed and set aside for reuse. Sharp states that they can create a silicon wafer every 8 seconds, but doesn’t provide further details about the efficiency of the wafer, or any other useful info. We do know that in 2006, the efficiency with this tech was 14.6%, so possibly two years later, the efficiency is even better. Either way, they must think it’s pretty great because they’ve already set up an automation line for mass production. So this could be a so-called miracle cure, or not. We’ll have to wait and see.
written by ThetaNoon, September 10, 2008
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